Calibrate piezoresistive stress sensors through the assembled structure

Journal of Electronic Packaging

Volumn 125, Issue 2 SPEC., 2003, Pages 289-293

  Lwo, Ben Je ^a   Wu, Shen Yu ^a  

^a NATIONAL DEFENSE UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CALIBRATION; ELECTRIC RESISTANCE MEASUREMENT; ELECTRONICS PACKAGING; INTEGRATED CIRCUIT MANUFACTURE; MATHEMATICAL MODELS; MICROELECTRONIC PROCESSING; RESISTORS; SENSORS; SILICON WAFERS; TEMPERATURE;

MICROELECTRONIC PACKAGE; PIEZORESISTIVE STRESS SENSORS;

PIEZOELECTRIC DEVICES;

EID: 0141606835     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1572904     Document Type: Article

References (14)

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