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Volumn 85, Issue 11, 1999, Pages 7556-7561
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An rf sustained argon and copper plasma for ionized physical vapor deposition of copper
a a a a a |
Author keywords
[No Author keywords available]
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Indexed keywords
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EID: 0043280888
PISSN: 00218979
EISSN: None
Source Type: Journal
DOI: 10.1063/1.370554 Document Type: Article |
Times cited : (20)
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References (13)
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