Design and implementation of a modulator-based free-space optical backplane for multiprocessor applications

Applied Optics

Volumn 42, Issue 14, 2003, Pages 2465-2481

  Kirk, Andrew G ^a   Plant, David V ^a   Vranesic, Zvonko G ^c   Tooley, Frank A P ^d   Rolston, David R ^e   Ayliffe, Michael H ^f   Lacroix, Frederic K ^g   Robertson, Brian ^h   Bernier, Eric ⁱ   Brosseau, Daniel F ^j  

^a MCGILL UNIVERSITY   (Canada)

^b MCMASTER UNIVERSITY   (Canada)

^c UNIVERSITY OF TORONTO   (Canada)

^d Terahertz Photonics   (United Kingdom)

^e Lighthouse Photonics Inc   (Canada)

^f Ignis Optics   (United States)

^g Ciena Corporation   (United States)

^h UNIVERSITY OF CAMBRIDGE   (United Kingdom)

ⁱ NORTEL NETWORKS   (Canada)

^j 1er Etage   (Canada)

more..

Author keywords

[No Author keywords available]

Indexed keywords

MICROPROCESSOR CHIPS; MULTIPROCESSING SYSTEMS; OPTICAL DESIGN; OPTICAL INTERCONNECTS; OPTOELECTRONIC DEVICES; SEMICONDUCTOR QUANTUM WELLS; TRANSCEIVERS; VLSI CIRCUITS;

OPTICAL BACKPLANE;

LIGHT MODULATORS;

EID: 0043095377     PISSN: 1559128X     EISSN: 21553165     Source Type: Journal    
DOI: 10.1364/AO.42.002465     Document Type: Article

References (50)

1. J. H. Collet, D. Litaize, J. Van Campenhout, C. Jesshope, M. Desmulliez, H. Thienpont, J. Goodman, and A. Louri, “Architectural approach of the role of optics in monoprocessor and multiprocessor machines,” Appl. Opt. 39, 671-682 (2000).
2. J. H. Collet, W. Hlayhel, and D. Litaize, “Parallel optical interconnects may reduce the communication bottleneck in symmetric multiprocessor computers,” Appl. Opt. 40, 3371-3378 (2001).
3. F. J. Levi, “Optical interconnects in systems,” Proc. IEEE 88, 750-757 (2000).
4. D. A. B. Miller, “Rationale and challenges for optical interconnects to electrical chips,” Proc. IEEE 88, 728-749 (2000).
5. M. R. Feldman, S. C. Esener, C. G. Guest, and S. H. Lee, “Comparison between optical and electrical interconnects based on power and speed considerations,” Appl. Opt. 27, 1742-1751 (1989).
6. E. D. Kyriakis-Bitzaros, N. Haralabidis, M. Lagadas, A. Geor-gakilas, Y. Moisiadis, and G. Halkias, “Realistic end-to-end simulation of the optoelectronic links and comparison with the electrical interconnections for system-on-chip applications,” J. Lightwave Technol. 19, 1532-1542 (2001).
7. R. Grindley, T. Abdelrahman, S. Brown, S. Caranci, D. DeVries, B. Gamsa, A. Grbic, M. Gusat, R. Ho, O. Krieger, G. Lemieux, K. Loveless, N. Manjikian, P. McHardy, S. Srbljic, M. Stumm, Z. Vranesic, and Z. Zilic, “The NUMAchine multiprocessor,” in Proceedings of the International Conference on Parallel Processing (IEEE Computer Society), 487-496 (2000).
8. V. Krishnamoorthy and D. A. B. Miller, “Firehose architectures for free-space optically interconnected VLSI circuits,” J. Parallel and Distributed Computing 41, 109-114 (1997).
9. T. H. Szymanski and H. S. Hinton, “Reconfigurable intelligent optical backplane for parallel computing and communications,” Appl. Opt. 35, 1253-1268 (1996).
10. T. H. Szymanski and H. S. Hinton, “Optoelectronic smart pixel array for a reconfigurable intelligent optical interconnect,” U.S. Patent 6,016,211 (18 January 2000).
11. H. S. Hinton, T. J. Cloonan, F. B. McCormick, A. L. Lentine, and F. A. P. Tooley, “Free-space digital optical systems,” Proc. IEEE 82, 1632-1648 (1994).
12. Y. S. Liu, G. C. Boisset, M. H. Ayliffe, R. Iyer, and D. V. Plant, “Design, implementation and characterisation of a four stage hybrid optical system for a free-space optical backplane demonstrator,” Appl. Opt. 37, 2895-2914 (1998).
13. D. A. B. Miller, “Novel analog self-electro-optic-effect devices,” IEEE J. Quantum Electron. 29, 678 -698 (1993).
14. M. B. Venditti, E. Laprise, J. Faucher, P.-O. Laprise, J. S. Ahearn, and D. V. Plant, “Design and verification of an OE-VLSI chip with 1080 VCSELs and PDs heterogeneously integrated with CMOS,” Proc. IEEE/LEOS 2001 Annual Meeting, PD-1.4. (2001).
15. A. L. Lentine, K. W. Goossen, J. A. Walker, L. M. F. Chirovsky, L. A. D’Asaro, S. P. Hui, B. J. Tseng, R. E. Leibenguth, J. E. Cunningham, W. Y. Jan, J.-M. Kuo, D. W. Dahringer, D. P. Kossives, D. D. Bacon, G. Livescu, R. L. Morrison, R. A. Novotny, and D. B. Buchholz, “High-speed optoelectronic VLSI switching chip with >4000 optical I/O based on flip-chip bonding of MQW modulators and detectors to silicon CMOS,” IEEE J. Sel. Top. Quantum Electron. 2, 77-84 (1996).
16. D. T. Neilson, “Optimization and tolerance analysis of QCSE modulators and detectors,” IEEE J. Quantum Electron. 33, 1094-1103 (1997).
17. D. Rolston, “The design, layout and characterization of VLSI optoelectronic chips for free-space optical interconnects,” Ph.D. dissertation (McGill University, Montreal, Canada, 2000).
18. J. M. Sasian, R. A. Novotny, M. G. Beckman, S. L. Walker, M. J. Wojcik, and S. J. Hinterlong, “Fabrication of fiber bundle arrays for free-space photonic switching systems,” Opt. Eng. 33, 2979-2985 (1994).
19. C. V. Cryan, “Two-dimensional multimode fiber array for optical interconnects,” Electron. Lett. 34, 586-587 (1998).
20. T. Maj, A. G. Kirk, D. V. Plant, J. F. Ahadian, C. G. Fonstad, K. L. Lear, K. Tatah, M. S. Robinson, and J. A. Trezza, “Interconnection of a two-dimensional array of vertical-cavity surface-emitting lasers to a receiver array by means of a fiber image guide,” Appl. Opt. 39, 683-689 (2000).
21. D. M. Chiarulli, S. P. Levitan, P. Derr, R. Hofmann, B. Greiner, and M. Robinson, “Demonstration of a multichannel optical interconnection by use of imaging fiber bundles butt coupled to optoelectronic circuits,” Appl. Opt. 39, 698-703 (2000).
22. Y. Li, T. Wang, H. Kosaka, S. Kawai, and K. Kasahara, “Fiber-image-guide-based bit-parallel optical interconnects,” Appl. Opt. 35, 6920-6933 (1996).
23. R. T. Chen, L. Lin, C. Choi, Y. J. Liu, B. Bihari, L. Wu, S. Tang, R. Wickman, B. Picor, M. K. Hibb-Brenner, J. Bristow, and Y. S. Liu, “Fully embedded board-level guided-wave optoelectronic interconnects,” Proc. IEEE 88, 780-793 (2000).
24. F. B. McCormick, F. A. P. Tooley, T. J. Cloonan, J. M. Sasian, and H. S. Hinton, “Optical interconnects using microlens arrays,” Opt. Quantum Electron. 34, 6471-6480 (1992).
25. C. Berger, J. Ekman, X. Wang, P. Marchand, H. Spaanenburg, F. Kiamilev, and S. Esener, “Parallel distributed free-space optoelectronic computer engine using flat ‘plug-on-top’ optics package,” Optics in Computing 2000, R. A. Lessard and T. V. Galstian, eds., Proc. SPIE 4089, 1037-1045 (2000).
26. M. W. Haney, M. P. Christianson, F. Milojkovic, G. J. Fokken, M. Vickberg, B. K. Gilbert, J. Rieve, J. Erkman, P. Chandra-mani, and F. Kiamilev, “Description and evaluation of the fast-net smart pixel-based optical interconnection prototype,” Proc. IEEE 88, 819-828 (2000).
27. D. Fey, W. Erhard, M. Gruber, J. Jahns, H. Bartelt, G. Grimm, L. Hoppe, and S. Sinzinger, “Optical interconnects for neural and reconfigurable VLSI architectures,” Proc. IEEE 88, 838 -848 (2000).
28. W. Lohmann, “Image formation of dilute arrays for optical information processing,” Opt. Commun. 86, 365-370 (1991).
29. D. R. Rolston, B. Robertson, H. S. Hinton, and D. V. Plant, “Analysis of a microchannel interconnect based on the clustering of smart-pixel-device windows,” Appl. Opt. 35, 1220-1233 (1996).
30. H. Thienpont, C. Debaes, V. Baukens, H. Ottevaere, P. Vynck, P. Tuteleers, G. Verschaffelt, B. Volckaerts, A. Hermanne, and M. Hanney, “Plastic microoptical interconnection modules for parallel free-space inter- and intra-MCM data communication,” Proc. IEEE 88, 769-779 (2000).
31. D. T. Neilson and C. P. Barrett, “Performance trade-offs for conventional lenses in free-space digital optics,” Appl. Opt. 35, 1240-1248 (1996).
32. B. Robertson, “Design of an optical interconnect for photonic backplane applications,” Appl. Opt. 37, 2974-2984 (1998).
33. F. Lacroix, E. Bernier, M. H. Ayliffe, F. A. P. Tooley, D. V. Plant, and A. G. Kirk, “Implementation of a compact, four-stage, scalable optical interconnect for photonic backplane applications,” Appl. Opt. 41, 1541-1555 (2002).
34. F. K. Lacroix, “Design, analysis and implementation of freespace optical interconnects,” Ph.D. dissertation (McGill University, Montreal, Canada, 2001).
35. D.-F. Brosseau, F. Lacroix, M. H. Ayliffe, E. Bernier, B. Robertson, F. A. P. Tooley, D. V. Plant, and A. G. Kirk, “Design, implementation, and characterization of a kinematically aligned, cascaded spot array generator for a modulator-based free-space optical interconnect,” Appl. Opt. 39, 733-745 (2000).
36. B. Robertson, Y. Liu, G. C. Boisset, M. R. Taghizadeh, and D. V. Plant, “In situ interferometric alignment systems for the assembly of microchannel relay systems,” Appl. Opt. 35, 9253-9260 (1997).
37. M. H. Ayliffe, M. Chateauneuf, D. R. Rolston, A. G. Kirk, and D. V. Plant, “Design and testing of a kinematic package supporting a 32 X 32 array of GaAs modulators flip-chip bonded to a CMOS chip,” IEEE J. Lightwave Technol. 19, 1543-1599 (2001).
38. M. H. Ayliffe, “Alignment and packaging techniques for twodimensional free-space optical interconnects,” Ph.D. dissertation (McGill University, Montreal, Canada, 2001).
39. C. Alleyne and A. G. Kirk, “Transmission uniformity of diffractive parallel optical interconnect relays: A numerical analysis based on rigorous coupled wave theory,” Proc. 15th IEEE LEOS Annual Meeting, Vol 2, 901-902 (2002).
40. D. T. Neilson and E. Schenfeld, “Free-space optical relay for the interconnection of multimode fibers,” Appl. Opt. 38, 2297-2300 (1999).
41. C. Debaes, M. Vervacke, H. Onevaere, W. Meeus, P. Tuteleers, M. Brunfaut, V. Baukens, J. Van Campenhout, H. Thienpont, “Demonstration of manufacturable free-space modules for multichannel intra-chip optical interconnects,” Proc. 15th IEEE LEOS Annual Meeting, Vol 1, 63-64 (2002).
42. F. Thomas-Dupuis, M. Chateauneuf, and A. G. Kirk, “Assembly and characterization of a folded spot array generator for a modulator-based free-space optical interconnect,” Proc. Intl. Topical Meeting on Optics in Computing, Vol. 1, Taipei, Taiwan, 328-330 (2002).
43. M. Chateauneuf, A. G. Kirk, D. V. Plant, T. Yamamoto, J. D. Ahearn, and W. Luo, “512-channel vertical-cavity surface-emitting laser based free-space optical link,” Appl. Opt. 41, 5552-5561 (2002).
44. D. V. Plant, M. B. Venditti, E. Laprise, J. Faucher, K. Razavi, M. Chateauneuf, A. G. Kirk, and J. D. Ahearn, “A 256 Channel Bi-Directional Optical Interconnect Using VCSELs and Photodiodes on CMOS,” J. Lightwave Technol. 19, 1093-1103 (2001).
45. G. Kirk, F. Lacroix, F. Mathieu, and F. Tooley, “Demonstration of a free-space optical broadcast network,” in Optics in Computing, Vol. 8, 1997 OSA Technical Digest (Optical Society of America, Washington, D.C., 1997), pp. 165-167.
46. J. A. B. Dines, D. T. Nelson, J. F. Snowdon, and B. S. Wherrett, “A comparison of massively parallel interconnect topologies employing optical highways,” in Optics in Computing, Vol. 8, 1997 OSA Technical Digest (Optical Society of America, Washington, D.C., 1997), pp. 186-188.
47. T. H. Szymanski and V. Tyan, “Error and flow control for a terabit free-space optical backplane,” IEEE J. Sel. Top. Quantum Electron. 838-846 (1999).
48. T. H. Szymanski, “Bandwidth optimization of optical datalinks using error control codes,” Appl. Opt. 1761-1775 (2000).
49. J. Faucher, M. B. Venditti, E. Laprise, and D. V. Plant, “Application of parallel forward error correction in twodimensional optical data links,” IEEE J. Lightwave Technol. (to be published) (2003).
50. C.-H. Chen, B. Hoanca, C. B. Kuznia, A. A. Sawchuk, and J.-M. Wu, “TRANslucent smart pixel array (TRANSPAR) chips for high throughput networks and SIMD signal processing,” IEEE J. Sel. Top. Quantum Electron. 5, 316-329 (1999).