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Physical Review Letters

Volumn 79, Issue 4, 1997, Pages 709-712

Validity of the linear growth equation for interface evolution for copper electrodeposition in the presence of organic additives

(3) Vazquez L a Salvarezza, R C a Arvia, A J a

a INSTITUTO DE INVESTIGACIONES FISICOQUÍMICAS TEÓRICAS Y APLICADAS INIFTA (Argentina)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0343736959 PISSN: 00319007 EISSN: 10797114 Source Type: Journal
DOI: 10.1103/PhysRevLett.79.709 Document Type: Article

Times cited : (53)

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