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Journal of the Electrochemical Society

Volumn 147, Issue 10, 2000, Pages 3889-3891

Increased copper outplating from dilute HF solutions on microstructurally modified silicon surfaces

(3) Chen, Zhan a Lee, Seung Mahn a Singh, Rajiv K a

a University of Florida (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AMORPHOUS SILICON; CRYSTAL STRUCTURE; IONS; MICROSTRUCTURE; NUCLEATION; PARTICLE SIZE ANALYSIS; SCANNING ELECTRON MICROSCOPY; SOLUTIONS; SUBSTRATES; TRANSMISSION ELECTRON MICROSCOPY;

AMORPHOUS CRYSTALLINE TRANSITION; COPPER OUTPLATING; PATTERN FORMATION; POLYCRYSTALLINE STRUCTURE; SHARP CIRCULAR BOUNDARY;

COPPER PLATING;

EID: 0034296387 PISSN: 00134651 EISSN: None Source Type: Journal
DOI: 10.1149/1.1393991 Document Type: Article

Times cited : (3)

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