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Volumn 35, Issue 2-3, 2003, Pages 97-105

An interconnect scaling scheme with constant on-chip inductive effects

Author keywords

[No Author keywords available]

Indexed keywords

CROSSTALK; ELECTRIC FIELDS; ELECTRIC RESISTANCE; INDUCTANCE; MAGNETIC FIELDS; VLSI CIRCUITS;

EID: 0042349706     PISSN: 09251030     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1024118330055     Document Type: Article
Times cited : (4)

References (12)
  • 1
    • 0004245602 scopus 로고    scopus 로고
    • International technology roadmap for semiconductors (ITRS)
    • "International Technology Roadmap for Semiconductors (ITRS)," 1999.
    • (1999)
  • 6
    • 0034852695 scopus 로고    scopus 로고
    • Analysis of on-chip inductance effects using a novel performance optimization methodology for distributed RLC interconnects
    • Banerjee, K. and Mehrotra, A., "Analysis of on-chip inductance effects using a novel performance optimization methodology for distributed RLC interconnects," in Proceedings 2001 Design Automation Conference, pp. 798-803, 2001.
    • (2001) Proceedings 2001 Design Automation Conference , pp. 798-803
    • Banerjee, K.1    Mehrotra, A.2
  • 7
    • 0034790238 scopus 로고    scopus 로고
    • Accurate analysis of on-chip inductance effects and implications for optimal repeater insertion and technology scaling
    • Banerjee, K. and Mehrota, A., "Accurate analysis of on-chip inductance effects and implications for optimal repeater insertion and technology scaling," in Proceedings 2001 IEEE Symposium on VLSI Circuits, pp. 195-198, 2001.
    • (2001) Proceedings 2001 IEEE Symposium on VLSI Circuits , pp. 195-198
    • Banerjee, K.1    Mehrota, A.2
  • 11
    • 0032292804 scopus 로고    scopus 로고
    • Influence of line dimensions on the resistance of Cu interconnections
    • December
    • Chen, F. and Gardner, D., "Influence of line dimensions on the resistance of Cu interconnections." IEEE Electron Device Letters 19, pp. 508-510, December 1998.
    • (1998) IEEE Electron Device Letters , vol.19 , pp. 508-510
    • Chen, F.1    Gardner, D.2
  • 12
    • 33747566850 scopus 로고    scopus 로고
    • 3-D ICs: A novel chip design for improving deep-submicrometer interconnect performance and system-on-chip integration
    • May
    • Banerjee, K., Souri, S. J., Kapur, P. and Saraswat, K. C. "3-D ICs: A novel chip design for improving deep-submicrometer interconnect performance and system-on-chip integration," in Proceedings of the IEEE 89, pp. 602-633, May 2001.
    • (2001) Proceedings of the IEEE , vol.89 , pp. 602-633
    • Banerjee, K.1    Souri, S.J.2    Kapur, P.3    Saraswat, K.C.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.