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Volumn 1, Issue , 2003, Pages 567-570

Architecture and interconnect technologies for a novel conformai active phased array radar module

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; RADAR SYSTEMS; SPURIOUS SIGNAL NOISE; THERMAL CONDUCTIVITY;

EID: 0042164433     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (18)

References (9)
  • 6
    • 84897543296 scopus 로고    scopus 로고
    • Millimeter-wave 3D integration techniques using LTCC and related multilayer circuits
    • October
    • W.Menzel, J.Kassner, "Millimeter-wave 3D integration techniques using LTCC and related multilayer circuits" 2000 European Microwave Conference, Digest vol. 2, pp. 33-36, October 2000
    • (2000) 2000 European Microwave Conference, Digest , vol.2 , pp. 33-36
    • Menzel, W.1    Kassner, J.2
  • 7
    • 0031251565 scopus 로고    scopus 로고
    • Coax via-A technique to reduce crosstalk and enhance impedance match at vias in high-frequency multilayer packages verified by FDTD and MoM modeling
    • October
    • E.R. Pillai, "Coax via-A technique to reduce crosstalk and enhance impedance match at vias in high-frequency multilayer packages verified by FDTD and MoM modeling", IEEE Trans. Microwave Theory and Tech., vol. 45, no. 10, pp. 1981-1985, October 1997
    • (1997) IEEE Trans. Microwave Theory and Tech. , vol.45 , Issue.10 , pp. 1981-1985
    • Pillai, E.R.1
  • 8
    • 0033871250 scopus 로고    scopus 로고
    • The use of metal filled via holes for improving isolation in LTCC RF and wireless multichip packages
    • February
    • G.E. Ponchak, C. Donghoon, J.-G.Yook, L. P. B. Katehi, "The use of metal filled via holes for improving isolation in LTCC RF and wireless multichip packages", IEEE Trans. on Packaging and Manufacturing Technology, vol. 23, no.1, pp. 88-99, February 2000
    • (2000) IEEE Trans. on Packaging and Manufacturing Technology , vol.23 , Issue.1 , pp. 88-99
    • Ponchak, G.E.1    Donghoon, C.2    Yook, J.-G.3    Katehi, L.P.B.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.