|
|
|
Volumn , Issue , 1997, Pages 211-215
|
|
Recent problems in electromigration testing
|
|
Author keywords
[No Author keywords available]
|
|
Indexed keywords
DELAMINATION;
ELECTROMIGRATION;
OHMIC CONTACTS;
RELIABILITY;
SEMICONDUCTING ALUMINUM COMPOUNDS;
SEMICONDUCTOR DEVICE TESTING;
SURFACE PHENOMENA;
TUNGSTEN FILLED CONTACTS;
INTERCONNECTION NETWORKS;
|
|
EID: 0030677263
PISSN: 00999512
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
|
Times cited : (9)
|
|
References (13)
|
