Electromigration performance of W-plug via-fed lead structures

Journal of the Electrochemical Society

Volumn 144, Issue 7, 1997, Pages 2522-2530

  Le, H A ^a   Tso, N C ^a   McPherson, J W ^a  

^a TEXAS INSTRUMENTS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; DIFFUSION IN SOLIDS; ELECTROMIGRATION; FAILURE (MECHANICAL); INTERFACES (MATERIALS); LEAD; TUNGSTEN;

MEDIAN TIME TO FAILURE (MTTF);

SEMICONDUCTOR DEVICE STRUCTURES;

EID: 0031187820     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1837848     Document Type: Article

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