Study on mechanical properties of eutectic and solid solution Pb-Sn-Ag solders from -200 °C to 150 °C

TMS Annual Meeting

Volumn , Issue , 1997, Pages 85-96

  Jones, W K ^a   Liu, Y ^a   Zampino, M A ^a   Gonzalez, G ^a   Shah, M ^a  

^a FLORIDA INTERNATIONAL UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DUCTILITY; ELECTRONICS PACKAGING; EUTECTICS; FRACTURE MECHANICS; LEAD ALLOYS; SCANNING ELECTRON MICROSCOPY; SOLID SOLUTIONS; STRENGTH OF MATERIALS; TENSILE TESTING; THERMAL EFFECTS;

ACOUSTIC PULSE METHODS; DYNAMIC MECHANICAL ANALYSIS (DMA);

SOLDERING ALLOYS;

EID: 0031357885     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)