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Volumn , Issue , 1996, Pages 30-35
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Temperature profiles for MCM-D flip chip assemblies at cryogenic conditions
a
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Author keywords
[No Author keywords available]
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Indexed keywords
BOILING LIQUIDS;
CMOS INTEGRATED CIRCUITS;
CONDUCTIVE MATERIALS;
COOLING;
CRYOGENICS;
DIODES;
EPOXY RESINS;
FLIP CHIP DEVICES;
MULTICHIP MODULES;
NITROGEN;
TEMPERATURE;
THERMODYNAMIC PROPERTIES;
CERAMIC FLATPACK;
FLIP CHIP ASSEMBLY;
IMMERSION COOLING;
LIQUID NITROGEN;
POOL BOILING CONDITIONS;
TEMPERATURE PROFILES;
THERMAL DIODES;
THERMAL MANAGEMENT;
THERMAL RESISTANCE;
THERMAL TEST CHIPS;
ELECTRONICS PACKAGING;
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EID: 0029713207
PISSN: 10652221
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (2)
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References (3)
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