Mechanical properties of Sn-In and Pb-In solders at low temperature

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn , Issue , 1997, Pages 64-67

  Jones, W K ^a   Liu, Y Q ^a   Shah, M ^a  

^a FLORIDA INTERNATIONAL UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEFORMATION; FRACTURE; FRACTURE MECHANICS; LEAD ALLOYS; LOW TEMPERATURE PRODUCTION; MECHANICAL PROPERTIES; STRENGTH OF MATERIALS; TENSILE TESTING; TIN ALLOYS;

ELONGATION; TEMPERATURE RANGE;

SOLDERING ALLOYS;

EID: 0030645127     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (11)