Electrochemical copper deposition on Au(100): A combined in situ STM and in situ surface X-ray diffraction study

Surface Science

Volumn 447, Issue 1, 2000, Pages 187-200

  Randler, R J ^a   Kolb, D M ^a   Ocko, B M ^b   Robinson, I K ^c  

^a UNIVERSITY OF ULM   (Germany)

^b BROOKHAVEN NATIONAL LABORATORY   (United States)

^c University of Illinois at Urbana Champaign   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTROCHEMISTRY; ELECTRODEPOSITION; EPITAXIAL GROWTH; FILM GROWTH; INTERFACES (MATERIALS); METALLIC FILMS; MONOLAYERS; SCANNING TUNNELING MICROSCOPY; SINGLE CRYSTALS; SULFURIC ACID; THERMODYNAMICS;

NERNST POTENTIAL;

GOLD;

EID: 0033895086     PISSN: 00396028     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0039-6028(99)01170-X     Document Type: Article

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