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Journal of Materials Science Letters

Volumn 22, Issue 13, 2003, Pages 945-947

Electrochemical reliability of plasma-polymerized cyclohexane films deposited on copper in microelectronic devices

(4) Park, Z T a Choi, Y S a Kim, J G a Boo, J H a

a Sungkyunkwan University (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTROCHEMICAL ELECTRODES; ELECTROCHEMISTRY; MONOMERS; PERMITTIVITY; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; PLASMA POLYMERIZATION; SEMICONDUCTING ORGANIC COMPOUNDS; ULSI CIRCUITS;

CYCLOHEXANE FILM; ELECTROCHEMICAL RELIABILITY; SATURATED CALOMEL ELECTRODE;

THIN FILMS;

EID: 0041765658 PISSN: 02618028 EISSN: None Source Type: Journal
DOI: 10.1023/A:1024679906737 Document Type: Article

Times cited : (8)

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