Texture and surface analysis of NiO buffer deposited on biaxially textured Ni tapes by a MOCVD method

IEEE Transactions on Applied Superconductivity

Volumn 13, Issue 2 III, 2003, Pages 2539-2542

  Sun, Jong Won ^a   Kim, Hyung Seop ^a   Ji, Bong Ki ^b   Park, Hai Woong ^d   Hong, Gye Won ^d   Jung, Choong Hwan ^c   Park, Soon Dong ^c   Jun, Byung Hyuk ^c   Kim, Chan Joong ^c  

^a Chungnam National University   (South Korea)

^b Sungkyunkwan University   (South Korea)

^c Korea Atomic Energy Research Institute   (South Korea)

^d NONE

Author keywords

Metal organic chemical vapor deposition (MOCVD); NiO buffer layer

Indexed keywords

ATOMIC FORCE MICROSCOPY; METALLORGANIC CHEMICAL VAPOR DEPOSITION; NICKEL COMPOUNDS; PARTIAL PRESSURE; SCANNING ELECTRON MICROSCOPY; SURFACE ROUGHNESS; TEXTURES;

BUFFER LAYERS;

SUPERCONDUCTING TAPES;

EID: 0041474705     PISSN: 10518223     EISSN: None     Source Type: Journal    
DOI: 10.1109/TASC.2003.811842     Document Type: Conference Paper

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