Bottom leaded plastic (BLP) package: a new design with enhanced solder joint reliability

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1996, Pages 448-452

  Kim, Young Gon ^a   Han, Bongtae ^a   Choi, Shin ^a   Kim, Myung Ki ^a  

^a LG Semicon Package R D Cent

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; DATA STORAGE EQUIPMENT; FINITE ELEMENT METHOD; PARAMETER ESTIMATION; RELIABILITY; SOLDERED JOINTS; SOLDERING; STRAIN; THREE DIMENSIONAL;

BOTTOM LEADED PLASTIC PACKAGE; COFFIN-MANSON RELATIONSHIP; SHEAR STRAIN; SOLDER JOINTS RELIABILITY;

ELECTRONICS PACKAGING;

EID: 0029708533     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (7)