Three-dimensional FEM simulations of thermomechanical stresses in 1.55 μm laser modules

Microelectronics Reliability

Volumn 43, Issue 7, 2003, Pages 1125-1136

  Deshayes, Y ^a   Bechou, L ^a   Deletage, J Y ^a   Verdier, F ^a   Danto, Y ^a   Laffitte, D ^b   Goudard, J L ^b  

^a UNIVERSITÉ BORDEAUX 1   (France)

^b NOKIA RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; CRACK PROPAGATION; FINITE ELEMENT METHOD; NEODYMIUM LASERS; SEMICONDUCTOR LASERS; STRAIN; STRESS ANALYSIS;

THERMOMECHANICAL STRESSES;

LASER APPLICATIONS;

EID: 0038789211     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(03)00099-4     Document Type: Conference Paper

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