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Volumn , Issue , 1996, Pages 13-19
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Optical module with MU connector interface using self-alignment technique by solder-bump chip bonding
a
a
NTT CORPORATION
(Japan)
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Author keywords
[No Author keywords available]
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Indexed keywords
BANDWIDTH;
INTEGRATED CIRCUIT MANUFACTURE;
LIGHT EMITTING DIODES;
OPTICAL FIBER COUPLING;
PHOTODIODES;
SEMICONDUCTOR LASERS;
SIGNAL RECEIVERS;
SOLDERING;
INTEGRATED CHIP CARRIER;
MICROSOLDER BUMP;
MU TYPE CONNECTORIZED RECEIVER;
OPTICAL MODULE;
PHOTONIC DEVICES;
PLANAR LIGHTWAVE CIRCUITS;
SOLDER BUMP CHIP BONDING;
INTEGRATED OPTOELECTRONICS;
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EID: 0029696686
PISSN: 05695503
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Article |
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Times cited : (6)
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References (9)
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