Defect formation mechanisms in laser welding techniques for semiconductor laser packaging

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 19, Issue 4, 1996, Pages 764-769

  Cheng, Wood Hi ^a,b   Wang, Wei Han ^b   Chen, Jyh G ^c  

^a IEEE

^b NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

^c NATIONAL YANG MING UNIVERSITY   (Taiwan)

Author keywords

Failure mechanism; Laser welding; Optoelectronic packaging; Semiconductor laser

Indexed keywords

CRACK PROPAGATION; CRYSTAL DEFECTS; FAILURE (MECHANICAL); LASER BEAM WELDING; OPTOELECTRONIC DEVICES; SEMICONDUCTOR LASERS;

DEFECT FORMATION MECHANISMS; POST WELD SHIFT (PWS); SEMICONDUCTOR LASER PACKAGING;

ELECTRONICS PACKAGING;

EID: 0030289416     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.544368     Document Type: Article

References (19)

1. M. R. Matthews, B. M. Macdonald, and K. R. Preston, "Optical components-the new challenge in packaging," IEEE Trans. Comp., Hybrids, Manufact. Technol., vol. 3, no. 4, pp. 798-806, 1990.
2. A. A. Hollander and K. J. Watkin, "The art and science of optoelectronic joining," Photon. Spectra, pp. 110-114, Oct. 1993.
3. S. Jang, "Packaging of photonic devices using laser welding," in Proc. SPIE, 1995, pp. 138-149.
4. V. T. Kowalski, R. J. Coyle, P. P. Solan, and K. M. Hogan, "Laser weld process improvements for optical isolator assembly," in Proc. 45th ECTC, 1995, pp. 1116-1121.
5. Kovar Alloy Handbook. PA: Westinghouse Electric Co., 1971.
6. Metals Handbook, vol. 1, 10th ed. OH: ASM, 1990, pp. 897-905.
7. Metals Handbook, vol. 8, 9th ed. OH: ASM, 1973, pp. 266-267.
8. R. J. Coyle, P. P. Solan, P. L. Sakach, and X. L. Yeh, "Intergranular embrittlement of laser welds by gold segregation," in Proc. ASM Int., 2nd Conf. Trends Welding Res., 1989, pp. 661-665.
9. B. Valk, R. Battig, and O. Anthamatren, "Laser welding for fiber pigtailing with long-term stability and submicron accuracy," Opt. Eng., vol. 34, no. 9, pp. 2675-2682, 1995.
10. S. G. Kang, M. K. Song, H. T. Lee, N. Hwang, S. S. Park, D. G. Kim, and K. E. Pyun, "Application of laser welding technique for high speed optical transmission device package," in LEOS Proc., 1995, pp. 246-247.
11. W. H. Cheng, W. H. Wang, H. Y. Chen, and H. H. Lin, "Reduction of micromovement in optoelectronic packaging," in LEOS Proc., 1995, pp. 248-249.
12. P. Su, T. S. Ravi, D. D. Mahoney, and D. A. Taylor, "Spot-welding technique for optoelectronic packages," in OFC Tech. Dig., 1994, pp. 144-145.
13. W. H. Cheng, W. H. Wang, Y. M. Huang, H. Y. Chen, and H. H. Lin, "Failure mechanism of hole formation in laser welding technique for optoelectronic packaging," in Proc. 45th ECTC, 1995, pp. 914-916.
14. J. C. Chen, W. T. Chen, S. T. Chang, J. S. Horng, H. H. Lin, W. H. Wang, and W. H. Cheng, "Failure mechanism of solidification cracks in semiconductor laser packaging," in Proc. 46th ECTC, 1996, pp. 946-950.
15. T. Miyazaki, "Material removal produced by a high-power-density electron beam," J. Appl. Phys., vol. 48, pp. 3035-3037, 1977.
16. C. Dawes, Laser Welding. Cambridge, England: Woodhead, 1992, ch. 4.
17. P. S. Wei, (private communication).
18. S. C. Wang, C. Wang, Y. K. Tu, C. J. Hwang, S. Chi, W. H. Wang, and W. H. Cheng, "Effect of Au coating on joint strength in laser welding for Invar-Invar packages," in Proc. 46th ECTC, 1996, pp. 942-945.
19. S. Rangwala, "A study of forces and motion generated during pulsed laser welding of optical packages," J. Electron. Packag., vol. 131, pp. 343-349, 1991.