Thermal stresses in box-type laser packages

Optical and Quantum Electronics

Volumn 31, Issue 4, 1999, Pages 293-302

  Cheng, W H ^a   Yang, Y D ^a   Liang, T C ^b   Wang, G L ^b   Sheen, M T ^a   Kuang, J H ^a  

^a NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

^b NATIONAL KAOHSIUNG UNIVERSITY OF APPLIED SCIENCES   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

DISSIMILAR MATERIALS; FINITE ELEMENT METHOD; GOLD; HEAT CONDUCTION; PROTECTIVE COATINGS; THERMAL EXPANSION; THERMAL GRADIENTS; THERMAL STRESS; WELDS;

THERMAL EXPANSION COEFFICIENT;

SEMICONDUCTOR LASERS;

EID: 0032680174     PISSN: 03068919     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1006966021861     Document Type: Article

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