Packaging of micro-optic components to meet Telcordia standards

Conference on Optical Fiber Communication, Technical Digest Series

Volumn 70, Issue , 2002, Pages 326-327

  McLeod, Robert R ^a   Wolkin, Michal ^a   Morozov, Valentine ^a   Sawyer, Kevin A ^b  

^a JDS UNIPHASE   (United States)

^b HSA Engineering   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRONICS PACKAGING; FAILURE ANALYSIS; FINITE ELEMENT METHOD; JOINTS (STRUCTURAL COMPONENTS); RELIABILITY; STANDARDS; STRESS ANALYSIS; TELECOMMUNICATION EQUIPMENT; THERMAL STRESS;

TELECOM PACKAGES;

MICROOPTICS;

EID: 0036438370     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. GR-1221, Generic Reliability Assurance Requirements for Passive Optical Component, (Telcordia Technologies, 1999).
2. Perry L. Martin, Electronic Failure Analysis Handbook (McGraw-Hill, 1999).
3. ABAQUS Standard manual (Hibbet, Karlsson, & Sorenson, Inc).