Wafer bonding and layer transfer for thin film ferroelectrics

Materials Research Society Symposium - Proceedings

Volumn 748, Issue , 2003, Pages 331-336

  Ruglovsky, Jennifer L ^a   Park, Young Bae ^a   Ryan, Cecily A ^b   Atwater, Harry A ^a,b  

^a HARVARD UNIVERSITY   (United States)

^b California Institute of Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; POSITIVE IONS; THERMODYNAMICS; THIN FILMS;

WAFER BONDING;

FERROELECTRIC THIN FILMS;

EID: 0038713655     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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