Ion transport in encapsulants used in microcircuit packaging

IEEE Transactions on Components and Packaging Technologies

Volumn 26, Issue 1, 2003, Pages 199-205

  Lantz II, Leon ^a   Pecht, Michael G ^b  

^a LABORATORY FOR PHYSICAL SCIENCES   (United States)

^b UNIVERSITY OF MARYLAND   (United States)

Author keywords

Corrosion; Ion diffusion; Moisture; Molding compounds; Reliability

Indexed keywords

DIFFUSION IN SOLIDS; ENCAPSULATION; ENERGY DISPERSIVE SPECTROSCOPY; EPOXY RESINS; INTERFACES (MATERIALS); IONIC CONDUCTION; MATHEMATICAL MODELS; MICROELECTRONIC PROCESSING; PH; PLASTIC MOLDS; SCANNING ELECTRON MICROSCOPY; SECONDARY ION MASS SPECTROMETRY;

ION DIFFUSION; MICROELECTRONIC ENCAPSULATION; POLYMER RESIN MATRIX;

ELECTRONICS PACKAGING;

EID: 0038481219     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2002.806183     Document Type: Article

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