GOLD-ALUMINUM BOND FAILURE INDUCED BY HALOGENATED ADDITIVES IN EPOXY MOLDING COMPOUNDS.

Volumn , Issue , 1986, Pages 420-428

  Khan, Muhib M ^a   Fatemi, Homi ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM AND ALLOYS; GOLD AND ALLOYS; MICROSCOPIC EXAMINATION - SCANNING ELECTRON MICROSCOPY;

BOND FAILURE;

BONDING;

EID: 0022934669     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)