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Volumn , Issue , 1990, Pages 244-251
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Effect of mold compound components on moisture-induced degradation of gold-aluminum bonds in epoxy encapsulated devices
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Author keywords
[No Author keywords available]
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Indexed keywords
EPOXY RESINS--ENCAPSULATION;
INTEGRATED CIRCUIT MANUFACTURE;
INTERMETALLICS;
SEMICONDUCTOR MATERIALS;
ANTIMONY TRIOXIDE;
AUTOCLAVE TESTING;
BONDING STRENGTH;
EPOXY ENCAPSULATED DEVICES;
GOLD WIRE-ALUMINUM BONDING;
MOISTURE-INDUCED DEGRADATION;
INTEGRATED CIRCUITS;
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EID: 0025646925
PISSN: 00999512
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (26)
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References (11)
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