Fabrication and characterization of resonant SOI micromechanical silicon sensors based on DRIE micromachining, freestanding release process and silicon direct bonding

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4936, Issue , 2002, Pages 194-204

  Gigan, O ^a   Chen, H ^b   Robert, O ^b   Renard, S ^a   Marty, F ^b  

^a TRONIC'S Microsystems   (France)

^b Groupe ESIEE   (France)

Author keywords

DRIE; Electronic interface; Micromachining; Release process; Resonator; Silicon; Simulation; Sticking; Vibration; Wafer bonding

Indexed keywords

CMOS INTEGRATED CIRCUITS; COMPUTER SIMULATION; FINITE ELEMENT METHOD; MICROELECTRONICS; SEMICONDUCTOR DEVICES; SILICON SENSORS;

SILICON DIRECT BONDING (SDB);

SILICON ON INSULATOR TECHNOLOGY;

EID: 0038417870     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.469740     Document Type: Conference Paper

References (17)

1. G. Stemme, 'Resonant silicon sensors', J. Micromech. Microeng, 1, 113-125, 1991
2. H.A.C. Tilmans, R. Legtenberg, 'Electrostatically driven vacuum-encapsulated polysilicon resonator', Sensors and Actuators, A45, 67-84, 1994
3. K.E.B. Thornton, D. Uttamchandani, B. Culshaw, 'A sensitive optically excited resonator pressure sensor', Sensors and Actuators, A24, 15-19, 1990
4. T.S.J. Lammerink, 'Optical operation of micro-mechanical resonant sensors', Thesis, Universiteit Twente. 1, 113-125, 1990
5. O. Robert, 'Oscillator based on MEMS resonator using an automatic gain controllable transimpedance amplifier', Proc. Int. MEMS workshop 2001, 643-652, 2001, Singapore
6. W. Weaver, 'Vibration Problems in Engineering', John Wiley & Sons, 5th ed.,1990
7. C. Bergaud, 'Multi-mode frequency analysis for the dynamic characterization of microstructures', Symp. Design Test and Microfabrication of MEMS and MOEMS, 757-764, Paris, 1999
8. A. Cheshmehdoost, B. E. Jones and B. O'Connor, 'Characteristics of a force transducer incorporating a mechanical DETF resonator', Sensors and Actuators, A52, 99-102, 1996
9. H.A.C. Tilmans, 'Equivalent circuit representation of electromechanical transducers', J. Micromech. Microeng, 7, 285-309, 1997
10. Hua Chen, 'Effect of different parameters on the resonant frequency stability of a parallele-plate type electrostatic micro resonator', Proc. Int. MEMS workshop 2001, 220-229, Singapore, 2001
11. Hua Chen, 'Large Amplitude Effects on the Resonant Frequency of Electrostatically Driven Microresonators: Theory and Experimental Validation', International Symposium on Smart Materials, Nano-, and Micro-Smart Systems, Melbourne, Australia, 2002 (in Press)
12. N. Tas et Al., 'Stiction in surface micromachining', J. Micromech. Microeng, 6, 385-397, 1996
13. 2 sacrificial layer for large-aera surface-micromachined membranes', Sensors and Actuators, A64, 247-251, 1998
14. A. Plössl, G. Krauter, 'wafer direct bonding: tailoring adhesion between brittle materials', Materials Science and Engineering, R25, 1-88, 1999
15. A. Bosseboeuf, S. Petitgrand, 'Optical techniques for static and dynamic characterization of MEMS' Proc. Seiken symposium 30 on Micro/Nano mechatronics. Tokyo, 25-26 March 2002, p.24/1-24/8,2002
16. O. Robert et Al, 'Design and fabrication of an analog ASIC interfacing a μ-resonant capacitive MEMS sensor in a high-temperature environment (200°C)', International Symposium on Smart Materials, Nano-, and Micro-Smart Systems, Melbourne, Australia, 2002 (in Press)
17. S. Petitgrand et Al, '3D measurement of micromachined devices vibration mode shapes with a stroboscopic interferometric mocroscope', Optics and Lasers in Engineering, 39, 77-101, 2001