Fine pitch stencil printing of Sn/Pb and lead free solders for flip chip technology

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1997, Pages 254-264

  Kloeser, Joachim ^a   Heinricht, Katrin ^a   Kutzner, Kai ^a   Jung, Erik ^a   Ostmann, Andreas ^a   Zakel, Elke ^a   Reichl, Herbert ^a  

^a FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

EUTECTICS; FLIP CHIP DEVICES; SUBSTRATES;

FINE PITCH STENCIL PRINTING;

SOLDERING ALLOYS;

EID: 0030647010     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (24)