Performance of a novel non-planar diaphragm for high-sensitivity structures

Microelectronics Journal

Volumn 34, Issue 9, 2003, Pages 791-796

  Wang, W J ^a   Lin, R M ^a   Ren, Y ^a   Li, X X ^b  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY   (China)

Author keywords

Corrugated diaphragm; High sensitivity; Polysilicon

Indexed keywords

DIAPHRAGMS; NATURAL FREQUENCIES; POLYSILICON; TENSILE STRESS;

NON-PLANAR DIAPHRAGMS;

MICROELECTRONICS;

EID: 0038148295     PISSN: 00262692     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2692(03)00150-2     Document Type: Article

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