Correlation of EMI measurements and simulations for simple package geometries

IEEE International Symposium on Electromagnetic Compatibility

Volumn 1, Issue , 2002, Pages 419-423

  Ji, Yun ^a   Slattery, Kevin P ^a   Skinner, Harry G ^a  

^a INTEL CORPORATION   (United States)

Author keywords

GTEM; Near field scan; Package EMI; TEM celI; TLM

Indexed keywords

ANECHOIC CHAMBERS; COMPUTER SIMULATION; CORRELATION METHODS; ELECTROMAGNETIC WAVES; ELECTRONICS PACKAGING; SIGNAL INTERFERENCE;

VECTOR NETWORK ANALYZERS (VNA);

INTEGRATED CIRCUIT TESTING;

EID: 0036385029     PISSN: 01901494     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. C.R. Paul, Introduction to Electromagnetic Compatibility, New York: John Wiley & Sons, 1992.
2. K.P. Slattery, J.P. Muccioli and T.M. North, "Modeling the radiated emissions from microprocessors and other VLSI devices," Proceedings of the IEEE International Symposium on Electromagnetic Compatibility, Washington D.C., Aug. 2000, vol. 1, pp. 163-168.
3. J.P. Muccioli, T.M. North and K.P. Slattery, "Characterization of the RF emissions from a family of microprocessors using a 1 GHz TEM cell," Proceedings of the IEEE International Symposium on Electromagnetic Compatibility, Austin, Texas, pp. 203-207.
4. K.P. Slattery, J.W. Neal, and W. Cui, "Near-field measurements of VLSI devices," IEEE Transactions on Electromagnetic Compatibility, vol. 41, pp. 374-384, Nov. 1999.
5. K.P. Slattery, J.P. Muccioli and T.M. North, "Constructing the Lagrangian of VLSI devices from near field measurements of the electric and magnetic fields," Proceedings of the IEEE International Symposium on Electromagnetic Compatibility, Washington D.C., Aug. 2000, vol. 1, pp. 129 - 134.
6. C. Christopoulos, The Transmission-Line Modeling Method: TLM, New Jersey: IEEE and Oxford University Press, 1994.