Comparison of various numerical modeling tools against a standard problem concerning heat sink emissions

IEEE International Symposium on Electromagnetic Compatibility

Volumn 2, Issue , 2001, Pages 1341-1346

  Archambeault, Bruce ^a   Pratapneni, Satish ^b   Zhang, Lauren ^b   Wittwer, David C ^c  

^a IBM   (United States)

^b DELL INC   (United States)

^c INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BENCHMARKING; COMPUTER SIMULATION; ELECTROMAGNETIC COMPATIBILITY; FINITE ELEMENT METHOD; METHOD OF MOMENTS; MICROELECTRONICS; MICROPROCESSOR CHIPS; NATURAL FREQUENCIES;

HEAT SINK EMISSIONS;

HEAT SINKS;

EID: 0035785538     PISSN: 01901494     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (0)