Development of a PWB with Capacitors for RF Module Applications

Journal of Japan Institute of Electronics Packaging

Volumn 5, Issue 7, 2002, Pages 636-640

  Shimada, Yasushi ^a   Otsuka, Kazuhisa ^a   Hirata, Yoshitaka ^a  

^a Resonac Corporation   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 1242283555     PISSN: 13439677     EISSN: 1884121X     Source Type: Journal    
DOI: 10.5104/jiep.5.636     Document Type: Article

References (9)

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3. H. Kattelus, et al.: “Passive Integration Process on Standard and High Resistivity Silicon”, The International Journal of Microelectronic Packaging, Vol.22, No.3, pp.254-261, 1999.
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5. S. Dalmia, et al.: “Design of Embedded High Q-Inductors in MCM-L Technology”, IEEE MTT-S International Microwave Symposium Digest, Vol. 3, pp.1735-1738. 2001.
6. B. Kim, et al.: “A New Test Method for Embedded Passives in High Density Package Substrates”, Proceedings of 2001 Electronic Components and Technology Conference, pp.1362-1366, 2001.
7. S. O'Reilly, et al.: “Routes to Embedded Inductors in MCM-L Technology-Design”, CAD and Manufacturing Issues, Proceedings of 1998 International Symposium on Microelectronics, pp.435-440, 1998.
8. P. Chahal, et al.: “Integration of Thin Film Passive Circuits Using High/Low Dielectric Constant Material”. Proceedings of 1997 Electronic Components and Technology Conference, pp.739-744, 1997.
9. P.H. Bowles, et al.: “An Overview of the NCMS/StorageTek Embedded Decoupling Capacitance Project”, Proceedings of 1999 International Symposium on Advanced Packaging Materials, pp.191-196. 1999.