Achievement of homogeneous AuSn solder by pulsed laser-assisted deposition

Journal of Electronic Materials

Volumn 28, Issue 10, 1999, Pages 1123-1126

  Belouet, C ^a   Villard, C ^a,b   Fages, C ^a   Keller, D ^a  

^a NOKIA RESEARCH CENTER   (United States)

^b CNRS   (France)

Author keywords

[No Author keywords available]

Indexed keywords

DEPOSITION; EUTECTICS; FLIP CHIP DEVICES; LASER PULSES; OPTOELECTRONIC DEVICES; SILICON WAFERS; SOLDERING ALLOYS;

PULSED LASER DEPOSITION (PLD);

GOLD ALLOYS;

EID: 0033344803     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-999-0249-x     Document Type: Article

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