Automated opto-electronic packaging for 10 Gb/s applications

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2001, Pages 429-432

  Verdiell, J M ^a   Webjorn, J ^a   Kohler, R ^a   Epitaux, M ^a   Finot, M ^a   Kirkpatrick, P ^a   Lake, R ^a   Colin, S ^a   Mader, T ^a   Bennett, J ^a  

^a LightLogic Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; CERAMIC MATERIALS; COMPUTER VISION; FACTORY AUTOMATION; LENSES; MICROOPTICS; OPTICAL FIBERS; OPTOELECTRONIC DEVICES; SOLDERING; SUBSTRATES; TRANSPONDERS;

AUTOMATED OPTO-ELECTRONIC PACKAGING; OPTOELECTRONIC ASSEMBLY;

ELECTRONICS PACKAGING;

EID: 0034835392     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: 10.1109/ECTC.2001.927762     Document Type: Article

References (3)

1. Fiber attachment for 980 nm pump lasers
2. Automation manufacturing system technology for opto-electronic device packaging
3. An innovative flexible and accurate packaging technique suited to fabricate low cost micro optoelectronic modules