Automated ribbon bonding: Electrical and mechanical benefits offer high-performance solutions

Advanced Packaging

Volumn 10, Issue 7, 2001, Pages 49-

  Roth, Laurie S ^a   Qin, Ivy W ^a   Werner, Robert E ^a  

^a Kulicke and Soffa   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0037802704     PISSN: 10650555     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (6)

1. Norman Stockham, telephone conversion, Microtechnology Centre, The Welding Institute, Cambridge, UK, January 2000.
2. Lawrence Skarin, "Mad Scientist," Electrical Engineering, Monroe Community College, www.madsci.org, 1998.
3. David C. Guidici, "Ribbon Wire Versus Round Wire Reliability for Hybrid Microcircuits," IEEE Transactions on Parts, Hybrids and Packaging, June 1975, pp. 159-163.
4. Christina M. Conway and Nicole L. Cavanah, "Gold Ribbon Bonding for Microelectronic Interconnection: A Designed Experiment to Evaluate Process Opportunities," 2000 International Symposium on Microelectronics, pp 681-687, 2000.
5. Keith I. Johnson and Stephen T. Riches, "Microjoining in Europe," 5th Annual Symposium of the Japan Welding Society, Tokyo, April 1990, pp. 239-244.
6. Y. Shirai et al, "High Reliability Wire Bonding by the 120 KHz Frequency of Ultrasonic," ICEMM Proceedings, pp. 366-375, 1993.