Lifetime prediction and design of reliability tests for high-power devices in automotive applications

Annual Proceedings - Reliability Physics (Symposium)

Volumn , Issue , 2003, Pages 523-528

  Ciappa, Mauro ^a   Carbognani, Flavio ^a   Cova, Paolo ^b   Fichtner, Wolfgang ^a  

^a ETH ZURICH   (Switzerland)

^b UNIVERSITY OF PARMA   (Italy)

Author keywords

Automotive electronics; Hybrid vehicles; Lifetime prediction; Power devices

Indexed keywords

CREEP; FATIGUE OF MATERIALS; POWER ELECTRONICS; STRESS RELAXATION; THERMAL CYCLING;

HIGH-POWER DEVICES;

AUTOMOTIVE ENGINEERING;

EID: 0037972617     PISSN: 00999512     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. M. Ciappa, W. Fichtner, Lifetime prediction of IGBT modules for traction applications, IEEE Int. Reliab. Physics Symp. 38(2000)210-216
2. M. Ciappa, F. Carbognani, P. Cova, W. Fichtner, A Novel Thermomechanics-based Lifetime Prediction Model for Cycle Fatigue Failure Mechanisms in Power Semiconductors, Microelectronic Reliability 42(2002)1653-1658
3. th Int. Symposium on Microelectronics IMAPS (2001), Baltimore, October 9-11, 2001
4. D. Rubesa, Lifetime prediction and constitutive modelling for creep-fatigue interaction, Bomtraeger, Berlin 1991
5. C. Yun, P. Malberti, M. Ciappa, W. Fichtner, Thermal Component Model for Electrothermal Analysis of IGBT Module Systems, IEEE Trans. on Adv. Packaging 24(2001)401-406
6. M. Ciappa, Some Reliability Aspects of IGBT Modules for High-Power Applications, Hartung-Gorre Editor (2001) ISBN 3-89649-657-3