Development of positive working photosensitive polyimide coatings for semiconductor packages

Journal of Photopolymer Science and Technology

Volumn 16, Issue 2, 2003, Pages 221-226

  Suwa, Mitsuhito ^a   Fujita, Youji ^a   Yuba, Tomoyuki ^a   Yoshida, Satoshi ^a   Tomikawa, Masato ^a  

^a TORAY INDUSTRIES INC   (Japan)

Author keywords

Adhesion; Chemical resistance; Copper; Migration; Molding compound; Photosensitive polyimide; Silicon

Indexed keywords

BENZOXAZOLE DERIVATIVE; BUFFER; COPPER; POLYIMIDE; SILICON;

ADHESION; ARTICLE; MATERIAL COATING; PACKAGING; PHOTOSENSITIVITY; SEMICONDUCTOR; SOLUBILITY;

EID: 0037830534     PISSN: 09149244     EISSN: None     Source Type: Journal    
DOI: 10.2494/photopolymer.16.221     Document Type: Article

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