Application for WLP at positive working photosensitive polybenzoxazole

Journal of Photopolymer Science and Technology

Volumn 15, Issue 2, 2002, Pages 173-176

  Yamamoto, Kagehisa ^a   Hirano, Takashi ^a  

^a Kiyohara Industrial Park ^*  (Japan)

Author keywords

Polybenzoxazole; Positive photosensitive; Wafer level packaging

Indexed keywords

BENZOXAZOLE DERIVATIVE; POLYBENZOXAZOLE; UNCLASSIFIED DRUG;

ADHESION; ARTICLE; DIELECTRIC CONSTANT; FILM; INTEGRATED CIRCUIT; MATERIAL COATING; PHOTOSENSITIVITY; SEMICONDUCTOR; WATER ABSORPTION;

EID: 0036355959     PISSN: 09149244     EISSN: None     Source Type: Journal    
DOI: 10.2494/photopolymer.15.173     Document Type: Article

References (3)

1. Properties of polyimide films cured on copper