A novel positive working photosensitive polyimide for wafer-level CSP packages

Journal of Photopolymer Science and Technology

Volumn 15, Issue 2, 2002, Pages 201-203

  Yuba, Tomoyuki ^a   Suwa, Mitsuhito ^a   Fujita, Yoji ^a   Tomikawa, Masao ^a   Ohbayashi, Gentaro ^a  

^a TORAY INDUSTRIES INC   (Japan)

Author keywords

Chemical resistance; Flux; Inter layer dielectrics; Stripper

Indexed keywords

POLYIMIDE;

ADHESION; ARTICLE; DIELECTRIC CONSTANT; FILM; PHOTOSENSITIVITY; STRESS;

EID: 0036355599     PISSN: 09149244     EISSN: None     Source Type: Journal    
DOI: 10.2494/photopolymer.15.201     Document Type: Article

References (3)