Morphology and interdiffusion behavior of evaporated metal films on crystalline diindenoperylene thin films

Journal of Applied Physics

Volumn 93, Issue 9, 2003, Pages 5201-5209

  Durr A C ^a   Schreiber, F ^a,b,c   Kelsch, M ^a   Carstanjen, H D ^f   Dosch, H ^f   Seeck, O H ^d,e  

^a MAX PLANCK INSTITUTE FOR INTELLIGENT SYSTEMS   (Germany)

^b UNIVERSITY OF STUTTGART   (Germany)

^c UNIVERSITY OF OXFORD   (United Kingdom)

^d FORSCHUNGSZENTRUM JÜLICH   (Germany)

^e DESY   (Germany)

^f NONE

Author keywords

[No Author keywords available]

Indexed keywords

CRYSTALLINE MATERIALS; FILM GROWTH; INTERDIFFUSION (SOLIDS); MORPHOLOGY; PHASE INTERFACES; RUTHERFORD BACKSCATTERING SPECTROSCOPY; THERMODYNAMIC STABILITY; THIN FILMS; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION;

BRAGG REFLECTION;

METALLIC FILMS;

EID: 0037648915     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1556180     Document Type: Article

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37. Sample A4 does not exhibit Kiessig fringes. Thus, the evaluation of the DIP- film thickness was made based on the values determined during the DIP deposition by the quartz-crystal microbalance and from the thickness observed in the TEM image of the film, respectively.
38. Samples A1 and A2 have been investigated in a different Synchrotron run than samples A3 and A4. We attribute the observed differences in thermal stability of the DIP layer between samples A1 and A2 on the one hand and A3 and A4 on the other hand to slight differences in the experimental setup (efficiency of the heating; thermal coupling, etc.).