Nanometer air gaps in semiconductor wafer bonding

Applied Physics Letters

Volumn 78, Issue 23, 2001, Pages 3726-3728

  Liau, Z L ^a   Liau, A A ^a,b  

^a MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

^b Belmont High School   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0035806154     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1377313     Document Type: Article

References (15)

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15. M (because of its considerable sensitivity to the relative index), whereas only a 7.5% correction was necessitated by the 3.5% decrease in β.