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Volumn 62, Issue 3-6, 2003, Pages 495-499

Monte Carlo simulation of electromigration phenomena in metallic lines

Author keywords

Electromigration; Percolation; Resistors

Indexed keywords

COMPUTER SIMULATION; FAILURE ANALYSIS; MONTE CARLO METHODS; PERCOLATION (SOLID STATE); RANDOM PROCESSES; RESISTORS; STRESS ANALYSIS;

EID: 0037417002     PISSN: 03784754     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0378-4754(02)00221-5     Document Type: Conference Paper
Times cited : (2)

References (10)
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    • Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics
    • K. Maex, Y.C. Joo, G.S. Oehrlein, S. Ogawa, J.T. Wetzel(Eds.)
    • C. Pennetta, L. Reggiani, G. Trefan, F. Fantini, I. De Munari, A. Scorzoni, in: K. Maex, Y.C. Joo, G.S. Oehrlein, S. Ogawa, J.T. Wetzel (Eds.), Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics, Mater. Res. Soc. Symp. Proc. 612 (2000) D2.7.1.
    • (2000) Mater. Res. Soc. Symp. Proc. , vol.612
    • Pennetta, C.1    Reggiani, L.2    Trefan, G.3    Fantini, F.4    De Munari, I.5    Scorzoni, A.6
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    • Investigation of the role of compositional effects on electromigration damage of metallic interconnects
    • Pennetta C., Reggiani L., Trefan G., Fantini F., Scorzoni A., De Munari I., Investigation of the role of compositional effects on electromigration damage of metallic interconnects. Comput. Mater. Sci. 22:2001;13.
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    • Pennetta, C.1    Reggiani, L.2    Trefan, G.3    Fantini, F.4    Scorzoni, A.5    De Munari, I.6


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.