Investigation of the role of compositional effects on electromigration damage of metallic interconnects

Computational Materials Science

Volumn 22, Issue 1-2, 2001, Pages 13-18

  Pennetta, C ^a,b   Reggiani, L ^a,b   Trefán, Gy ^a   Fantini, F ^c   Scorzoni, A ^d   De Munari, I ^e  

^a INFM   (Italy)

^b UNIVERSITY OF SALENTO   (Italy)

^c UNIVERSITY OF MODENA AND REGGIO EMILIA   (Italy)

^d UNIVERSITY OF PERUGIA   (Italy)

^e UNIVERSITY OF PARMA   (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM ALLOYS; COMPOSITION EFFECTS; COMPUTER SIMULATION; DISSOLUTION; ELECTROMIGRATION; MATHEMATICAL MODELS; MONTE CARLO METHODS; THERMAL EFFECTS;

METALLIC INTERCONNECTS;

THIN FILMS;

EID: 0034823691     PISSN: 09270256     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0927-0256(01)00157-4     Document Type: Article

References (12)