Surface characteristics of electroless and sputtered Ni- P-W alloy coatings

Surface and Coatings Technology

Volumn 166, Issue 1, 2003, Pages 60-66

  Wu, Fan Bean ^a   Tien, Shieh Kang ^a   Duh, Jenq Gong ^a   Wang, Jyh Hwa ^b  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b CHUNGHWA TELECOM CO LTD   (Taiwan)

Author keywords

Electroless plating; Ni P W coating; RF magnetron sputtering; Surface morphology; Surface roughness

Indexed keywords

ANNEALING; ATOMIC FORCE MICROSCOPY; ELECTRODES; HEAT TREATMENT; MAGNETRON SPUTTERING; NICKEL ALLOYS; SURFACE ROUGHNESS; TRANSMISSION ELECTRON MICROSCOPY;

ELECTROLESS COATINGS;

TERNARY SYSTEMS;

ANNEALING; COATING; ELECTROLESS PLATING; NICKEL ALLOY; STRUCTURAL ANALYSIS; SURFACE ROUGHNESS;

EID: 0037416543     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0257-8972(02)00725-9     Document Type: Article

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