Fabrication, thermal stability and microhardness of sputtered Ni-P-W coating

Surface and Coatings Technology

Volumn 150, Issue 2-3, 2002, Pages 232-238

  Wu, Fan Bean ^a   Chen, Yung I ^b   Peng, Pei Jun ^b   Tsai, Yi Ying ^b   Duh, Jenq Gong ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

Electroless nickel; Microhardness; Ternary Ni P W alloy coating; Thermal stability

Indexed keywords

BINARY MIXTURES; COMPOSITION EFFECTS; ELECTROLESS PLATING; HARDNESS TESTING; MAGNETRON SPUTTERING; METALLOGRAPHIC MICROSTRUCTURE; MICROANALYSIS; MICROHARDNESS; NICKEL PLATING; TERNARY SYSTEMS; THERMODYNAMIC STABILITY; X RAY DIFFRACTION ANALYSIS;

ELECTRON PROBE MICROANALYSIS;

INORGANIC COATINGS;

FABRICATION; HARDNESS; METALLIC COATING; NICKEL ALLOY; SPUTTERING; STABILITY;

EID: 0037084748     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0257-8972(01)01514-6     Document Type: Article

References (22)