Fabrication and crystallization behaviors of sputtered Ni-Cu-P films on tool steel

Surface and Coatings Technology

Volumn 139, Issue 2-3, 2001, Pages 233-243

  Chang, Ying Chan ^a   Duh, Jenq Gong ^a   Chen, Yung I ^b  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

Crystallization behavior; Magnetron sputtering; Microhardness; Ni Cu P; Thermal stability

Indexed keywords

ANNEALING; CRYSTALLIZATION; FABRICATION; INDUSTRIAL APPLICATIONS; MAGNETRON SPUTTERING; NICKEL ALLOYS; THIN FILMS; TOOL STEEL; WEAR RESISTANCE;

BINARY FILMS;

COATINGS;

COATING; CRYSTALLIZATION; FABRICATION; HARDNESS; NICKEL ALLOY; SPUTTERING; STEEL;

EID: 0035873966     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0257-8972(01)01009-X     Document Type: Article

References (29)