Adhesion of copper and alumina from first principles

Journal of the American Ceramic Society

Volumn 86, Issue 4, 2003, Pages 696-700

  Wang, Xiao Gang ^a   Smith, John R ^a   Scheffler, Matthias ^b  

^a DELPHI CORPORATION   (United States)

^b FRITZ HABER INSTITUT DER MAX PLANCK GESELLSCHAFT   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; COPPER; FILM GROWTH; FRACTURE TOUGHNESS; HIGH RESOLUTION ELECTRON MICROSCOPY; INTERFACES (MATERIALS); MOLECULAR BEAM EPITAXY; MONOLAYERS; PROBABILITY DENSITY FUNCTION; X RAY PHOTOELECTRON SPECTROSCOPY;

TECHNICAL APPLICATIONS;

ALUMINA;

EID: 0037387433     PISSN: 00027820     EISSN: None     Source Type: Journal    
DOI: 10.1111/j.1151-2916.2003.tb03359.x     Document Type: Conference Paper

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