SCOPUS 정보 검색 플랫폼

Volumn 87, Issue 18, 2001, Pages 1861031-1861034

Copper/diamond adhesion and hydrogen termination

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; CHEMICAL VAPOR DEPOSITION; DIAMONDS; HYDROGEN; INTERFACES (MATERIALS); LATTICE CONSTANTS; PHASE TRANSITIONS; THERMAL CONDUCTIVITY OF SOLIDS;

SINGLE DANGLING BONDS (SDB); TRIPLE DANGLING BONDS (TDB);

COPPER;

EID: 0035968759 PISSN: 00319007 EISSN: None Source Type: Journal
DOI: None Document Type: Article

Times cited : (48)

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