Optimum Design of Elastomeric STructure of CSP-μ BGA with Thermo-Viscoelastic Analysis

Journal of Japan Institute of Electronics Packaging

Volumn 3, Issue 1, 2000, Pages 34-39

  Murakami, Gen ^a   Mita, Mamoru ^a   Nakamura, Shozo ^b   Miyano, Yasushi ^c  

^a HITACHI CABLE LTD   (Japan)

^b HITACHI LTD   (Japan)

^c KANAZAWA INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

Chip Scale Package; Residual Stress; Structural Design; Viscoelastic Analysis; Warp Deformation

Indexed keywords

EID: 0013452290     PISSN: 13439677     EISSN: 1884121X     Source Type: Journal    
DOI: 10.5104/jiep.3.34     Document Type: Article

References (2)

1. S. Nakamura, Y. Miyano, S. Sugimori and A. Kaneda: “Thermoviscoelastic Analysis of Residual Stresses in a Thermosetting Resin/Metal Laminated Beam Caused by Cooling”, J S M E International Journal, 31, p. 126, 1988.
2. M. L. Williams, R. F. Landle and J. D. Ferry: “The Temperature Dependence of Relaxation Mechanisms in Amorphous Polymers and Other Glass-Forming Liquids”, J. Am. Chem. Soc. 77, p. 3701, 1955.