Flip-chip BGA applied high-density organic substrate

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1999, Pages 243-249

  Baba, Shinji ^a   Wu, Qiang ^a   Hayashi, Eiji ^a   Watanabe, Masaki ^a   Matsushima, Hironori ^a   Tomita, Yoshihiro ^a   Takemoto, Yoshitaka ^a  

^a MITSUBISHI ELECTRIC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

DENSITY (SPECIFIC GRAVITY); ELECTRIC PROPERTIES; ELECTRONICS PACKAGING; HEAT LOSSES; INTEGRATED CIRCUIT LAYOUT; ORGANIC COMPOUNDS; RELIABILITY; SUBSTRATES; TERNARY SYSTEMS; THERMODYNAMIC PROPERTIES;

BUMPING; FLIP CHIP BALL GRID ARRAY; HIGH DENSITY ORGANIC SUBSTRATES; PIN COUNTS; UNDER BUMP METAL;

FLIP CHIP DEVICES;

EID: 0032656324     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (4)