Effect of neutral transport on the etch product lifecycle during plasma etching of silicon in chlorine gas

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 21, Issue 1, 2003, Pages 116-126

  Kiehlbauch, Mark W ^a   Graves, David B ^a  

^a University of California   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHLORINE; COMPUTER SIMULATION; DIELECTRIC PROPERTIES OF SOLIDS; DIFFUSION IN SOLIDS; SILICON WAFERS; SURFACE REACTIONS; TRANSPORT PROPERTIES; VAN DER WAALS FORCES;

CONVECTIVE FLOW; ETCH PRODUCT LIFECYCLE; NEUTRAL TRANSPORT; SILICON CHLORIDE;

PLASMA ETCHING;

EID: 0037273431     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1527952     Document Type: Article

References (22)

1. V. Vahedi, J. Daugherty, S. Huang, D. Cooperberg, R. A. Gottscho, H. J. Tao, H. J. Lin, C. S. Tsai, and M. S. Liang, Dry Process Symposium, Tokyo, Japan, November 1999.
2. S. J. Ullal, A. R. Godfrey, E. S. Aydil, E. A. Edelberg, L. Braly, J. Daugherty, and V. Vahedi, International Symposium of the American Vacuum Society, Boston, MA, 2000.
3. X. Songlin, S. Shiwen, Q. Xueyu, J. Holland, and D. Podlesnik, J. Vac. Sci. Technol. B 19, 166 (2001).
4. K. Tsujimoto, T. Kumihashi, and S. Tachi, Appl. Phys. Lett. 63, 1915, (1993).
5. S. Tachi, M. Izawa, K. Tsujimoto, T. Kure, N. Kofuji, K. Suzuki, R. Hamasaki, and M. Kojima, Dry Process Symposium, Tokyo, Japan, November 1998.
6. N. Kofuji, K. Tsujimoto, T. Kumihashi, and S. Tachi, Jpn. J. Appl. Phys., Part 1 34, 2489 (1995).
7. K. Nanbu, T. Morimoto, and M. Suetani, IEEE Trans. Plasma Sci. 27, 1379 (1999).
8. C. Lee, D. B. Graves, and M. A. Lieberman, Plasma Chem. Plasma Process. 16, 99 (1996).
9. D. J. Economou, T. J. Bartel, R. S. Wise, and D. P. Lymberopoulos, IEEE Trans. Plasma Sci. 23, 581 (1995).
10. Semiconductor International Association, International Technology Roadmap for Semiconductors: http://public.itrs.net (2001).
11. J. D. Bukowski, D. B. Graves, and P. Vitello, J. Appl. Phys. 80, 2614 (1996).
12. A. Fiala, M. Kiehlbauch, S. Mahnovski, and D. B. Graves, J. Appl. Phys. 86, 152 (1999).
13. M. W. Kiehlbauch and D. B. Graves, J. Appl. Phys. 89, 2047 (2001).
14. M. Surendra, Plasma Sources Sci. Technol. 4, 56 (1995).
15. T. E. Nitschke and D. B. Graves, J. Appl. Phys. 76, 5646 (1994).
16. G. A. Bird, Molecular Gas Dynamics and the Direct Simulation of Gas Flows (Oxford University Press, Oxford, 1994).
17. R. H. Edwards, in Rarefied Gas Dynamics, edited by J. Potter (American Institute of Aeronautics and Astronautics, New York, 1977).
18. A. V. Gorestsky, Masters thesis, University of California, Berkeley, CA, 2000
19. J. P. Chang, J. C. Arnold, G. C. H. Zau, S. Hyung-Shik, and H. H. Sawin, J. Vac. Sci. Technol. A 15, 1853 (1997).
20. J. P. Chang, A. P. Mahorowala, and H. H. Swain, J. Vac. Sci. Technol. A 16, 217 (1998).
21. J. P. Chang and H. H. Sawin, J. Vac. Sci. Technol. A 15, 610 (1997).
22. G. P. Kota, doctoral dissertation, University of California, Berkeley CA, 2000.